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Conference Paper
Design and Verification Methodologies of D-Band Antenna Modules for Security Imaging Applications
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- Authors
- Jae-Yeong Lee, Jungsoo Kim, Dong-Young Kim, Munkyo Seo, Il-Min Lee, Kyung-Hyun Park
- Issue Date
- 2023-07
- Citation
- International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting 2023, pp.329-330
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- This research presents the design and verification methodologies of cavity-backed slot antenna (CBSA) modules for D-band security imaging applications. First, to realize low-loss feeding networks in the D-band spectrum, the microstrip transmission line (TL) and 3-D interconnection structures based on the multi-layer low-temperature co-fired ceramic (LTCC) process have been designed and characterized. Moreover, to achieve low-loss interconnection in local-oscillation (LO) & intermediate-frequency (IF) parts of transmitting (TX)/receiving (RX) modules, the transition structures between FR-4 PCB and LTCC have been realized by utilizing a flip-chip bonding process. Second, the CBSA with low-loss 3-D interconnection structures has been proposed for coupling mitigation between the indium phosphide (InP) chipset and antenna. Finally, the antenna modules have been integrated with InP TX/RX chipsets using bonding wires. The measured EIRP of the TX module and conversion gain of the RX module exhibit 3.3∼6.6 dBm and 15.0∼25.5 dB at 117∼145 GHz , respectively.
- KSP Keywords
- 45 GHz, Bonding process, Bonding wires, Cavity-backed Slot antenna, Conversion gain, D-band, FR-4, Flip-chip(FC), Flip-chip bonding, Indium phosphide(InP), Low loss