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Insulated Metal Substrate의 Top Metal과 Bottom Metal 두께 변화에 따른 전력 모듈 열 방출 특성 분석
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- Issue Date
- 2023-06
- Citation
- 대한전자공학회 학술 대회 (하계) 2023, pp.116-119
- Publisher
- 대한전자공학회
- Language
- Korean
- Type
- Conference Paper
- Abstract
- Direct Bonded Copper (DBC) commonly used in Power Module can cause cracks due to the Coefficient of Thermal Expansion (CTE) mismatch between Cu and ceramic. Insulated metal substrate (IMS) are proposed to overcome these disadvantages of DBCs. Unlike the existing IMS Power module, it introduces the integrated structure of bottom metal and base plate. The dielectric of IMS has a lower heat dissipation capacity than the ceramic of DBC due to the low thermal conductivity of the dielectric, but to overcome this, the heat dissipation ability is improved by changing the thickness of the top metal and bottom metal. In this paper, thermal analysis simulation is conducted using COMSOL MULTIPHYSICS. Compared to DBC substrates using Al2O3 Ceramics, the top metal thickness of the IMS substrate is changed to 0.3mm to 2.5mm, and the heat dissipation ability is observed accordingly. In addition, the bottom metal thickness is changed to 3mm to 5mm and observed. The thicker the thickness of the top and bottom metal, the better the heat dissipation ability.
- KSP Keywords
- Analysis and simulation, COMSOL Multiphysics, Coefficient of thermal expansion, Direct bonded copper(DBC), Dissipation capacity, Heat Dissipation, Insulated metal substrate, Integrated structure, Low thermal conductivity, Thermal Analysis, power module