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Conference Paper
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
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- Authors
- Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Ji-Ho Joo, Jin-Hyuk Oh, Chan-Mi Lee, Yoon-Hwan Moon, Seok-Hwan Moon, Kwang-Seong Choi
- Issue Date
- 2023-09
- Citation
- European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4
- Language
- English
- Type
- Conference Paper
- Abstract
- Anisotropic conductive paste (ACP) or anisotropic conductive film (ACF) consisting of a polymer matrix and a metal-coated polymer bead are introduced as interconnection materials in mini-LED display panel packaging through a thermal compression bonding process. However, this packaging solution has been leading to important problems such as alignment difficulties due to high bonding temperature and pressure, and its repair issues for bad LED devices after the bonding process. Recently, laser-assisted bonding (LAB) process for mini-LED display packaging has been introduced to solve these problems [Ref. 1–2]. This study introduces, an anisotropic solder paste (ASP) using conductive solder particles and applies it to the mini-LED packaging through the LAB process.
- KSP Keywords
- Anisotropic Conductive Films(ACFs), Bonding process, Bonding temperature, Conductive paste, Display Panel, Interconnection materials, LED devices, LED display, LED packaging, Laser-Assisted Bonding, Metal-coated