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Conference Paper
94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
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- Authors
- Jiho Joo, Sang-Heung Lee, Dong-Young Kim, Chanmi Lee, Yong-Sung Eom, Gwang-Mun Choi, Kwang-Seong Choi
- Issue Date
- 2023-10
- Citation
- International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Fan-Out, High resolution, autonomous driving, proximity sensor, telecommunication system, wafer level packaging