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학술대회 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
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저자
주지호, 이상흥, 김동영, 이찬미, 엄용성, 최광문, 최광성
발행일
202310
출처
International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23
KSP 제안 키워드
Fan-Out, High-resolution, Wafer Level Packaging, autonomous driving, proximity sensor, telecommunication system