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Conference Paper
Dual Etch Processes of Sloped Via and Paste Fill for Through Silicon Via
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- Authors
- Dong-Pyo Kim, Yong-Hyun Ham, Ho-Jin Yoon, Jong-Chang Woo, Kun-Sik Park, Zin-Sig Kim, Kyu-Ha Baek, Kwang-Ho Kwon, Ki Jun Lee, Kwang-Soo No, Lee-Mi Do
- Issue Date
- 2010-07
- Citation
- Asia-Pacific Conference on Plasma Science and Technology (APCPST) 2010 / Symposium on Plasma Science for Materials (SPSM) 2010, pp.1-2
- Publisher
- 한국진공학회
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Through silicon vias(TSV)