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Conference Paper Electronic Device Technologies for mm-Wave/THz Applications Using Special Packaging Materials: Research Overview and Possibility
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Authors
Jae-Yeong Lee, Eui-Su Lee, Il-Min Lee, Kyung-Hyun Park
Issue Date
2023-11
Citation
International Conference on Advanced Electromaterials (ICAE) 2023, pp.1-2
Language
English
Type
Conference Paper
KSP Keywords
THz applications, electronic devices, millimeter wave(mmWave), packaging material
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