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Conference Paper Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration

Cited 2 time in scopus

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Authors: Kwang-Seong Choi, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-Seok Jang, Jin-Hyuk Oh, Jungho Shin, Ho-Gyeong Yun, Seok Hwan Moon, Yoon-Hwan Moon, Yong-Sung Eom

Issue Date: 2023-06

Citation: Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389

Language: English

Type: Conference Paper

DOI: https://dx.doi.org/10.1109/ECTC51909.2023.00237

KSP Keywords: Bonding technology, Enabling technologies, Laser-Assisted Bonding

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