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Journal Article
Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics
- Authors
- Sooyeon Kim, Chan-Gyu Choi, Sang-Rok Moon, Minkyu Sung, Eon-sang Kim, Ho-Jin Song, Hyunhak Jeong, Seung Hwan Kim, Seung-Hyun Cho
- Issue Date
- 2023-11
- Citation
- Journal of Electromagnetic Engineering and Science, v.23, no.6, pp.470-481
- ISSN
- 2671-7255
- Publisher
- The Korean Institute of Electromagnetic Engineering and Science
- Language
- English
- Type
- Journal Article
- Abstract
- In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by the bondwire were analyzed through an electromagnetic simulation. Furthermore, a photonics-based sub-THz wireless link with a carrier frequency of 288 GHz was established using a packaged amplifier module. The amplifier module was placed at the output of the sub-THz transmitter based on a uni-traveling-carrier photodiode and at the input of the sub-THz receiver. The maximum gain and 3 dB bandwidth of the amplifier module are 17.3 dB and 39 GHz, respectively. With this setup, we successfully transmitted a 100-Gbps 16-QAM modulated signal, employing a carrier frequency of 288 GHz, across a wireless distance of 100 m.
- KSP Keywords
- 16 quadrature amplitude modulation(16QAM), 3-dB bandwidth, 39 GHz, Carrier frequency, Gain flatness, Modulated signals, Sub-THz, THz band, Uni-traveling-carrier photodiode(UTC-PD), Wireless transmission, broadband communication
This work is distributed under the term of Creative Commons License (CCL)
(CC BY NC)
(CC BY NC)
