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Conference Paper 성형가공품의 두께불량 측정 방법 및 장치에 관한 연구

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Authors: 이용귀, 김창범, 이재영, 손지연, 공현중

Issue Date: 2023-06

Citation: 대한전자공학회 학술 대회 (하계) 2023, pp.1778-1782

Language: Korean

Type: Conference Paper

Project Code: 23HR3400, Development of manufacturing digital twin framework technology that supports scalability and distributed simulation , Ji Yeon Son

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