본 논문에서는 SiC 기판 위에 0.15 μm AIGaN/GaN HEMT(High Electron Mobility Transistor)를 이용하여 X-대역 전력증폭기 MMIC 설계 및 공정 제작한 결과를 보여준다. 출력전력을 높이기 위해 GaN HEMT 소자를 2-way 분배기와 결합기를 이용하여 병렬로 연결하는데 이중에서 분배기 부분을 증폭기 안정화 회호호 사용한 저항-커페시터(RC)로 설계하여 칩면적을 줄일 수 있는 회로구조를 적용하였다. 설계 및 제작한 X-대역 전력증폭기는 측정한 결과, 3 dB 대역폭은 약 2 GHz 이며 주파수 9.1~10.9 GHz 에서 이특(SSUB21/SUB)은 20~23 dB, 입력정합(SSUB11/SUB)은 -22~-7 dB, 출력정합(SSUB22/SUB) 은 -14~-8 dB 이며, 출력전력은 41.6~41.9 dBm, 14.5~15.5 W, 전력부가 효율(PAE)은 21~24%의 특성을 얻었다. 칩 크기는 입출력 패드 및 DC 입력 패드를 포함하여 4.0 mm x 2.1 mm이다.
KSP Keywords
Band Power, GaN HEMT technology, High-electron mobility transistor(HEMT), Power amplifier MMIC, power amplifiers(PAs), x-band
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