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Conference Paper
A Comparative Study of Au Stud and Cu Pillar in Flip-Chip bonding for 2.5D/3D Integrated Terabit Optical Chiplet
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- Authors
- Jyung Chan Lee, Joon Ki Lee
- Issue Date
- 2024-07
- Citation
- Optics and Photonics Congress 2024, pp.1-1
- Publisher
- Optical Society of Korea
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- 3D integrated, Cu pillar, Flip-chip(FC), Flip-chip bonding, comparative study