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Journal Article 글로벌 파운드리 Big3의 첨단 패키징 기술개발 동향
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Authors
전황수, 최새솔, 민대홍
Issue Date
2024-06
Citation
전자통신동향분석, v.39, no.4, pp.98-106
ISSN
1225-6455
Publisher
한국전자통신연구원
Language
Korean
Type
Journal Article
DOI
https://dx.doi.org/10.22648/ETRI.2024.J.390310
Abstract
Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.
KSP Keywords
Advanced packaging, Electrical connections, High performance, Low-Power, Semiconductor process, added value, digital transformation, semiconductor device
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
Type 4: