ETRI-Knowledge Sharing Plaform

KOREAN
논문 검색
Type SCI
Year ~ Keyword

Detail

Journal Article The Impact of Gate Annealing on Leakage Current and Radio Frequency Efficiency in AlGaN/GaN High-Electron-Mobility Transistors
Cited 0 time in scopus Download 50 time Share share facebook twitter linkedin kakaostory
Authors
Junhyung Kim, Gyejung Lee, Kyujun Cho, Jong Yul Park, Byoung-Gue Min, Junhyung Jeong, Hong-Gu Ji, Woojin Chang, Jong-Min Lee, Dong-Min Kang
Issue Date
2024-10
Citation
ELECTRONICS, v.13, no.20, pp.1-8
ISSN
2079-9292
Publisher
MDPI
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.3390/electronics13204038
Abstract
Gallium Nitride (GaN) high-electron mobility transistors (HEMTs) are highly promising for high-frequency and high-power applications due to their superior properties, such as a wide energy bandgap and high carrier density. The performance of GaN HEMTs is significantly influenced by the interfacial states of the AlGaN barrier, and gate annealing has emerged as a key process for reducing leakage currents and enhancing DC/RF characteristics. This research investigates the impact of gate annealing on AlGaN/GaN HEMTs, focusing on two main aspects: leakage current reduction and improvements in DC and RF efficiency. Through comprehensive electrical analysis, including DC and RF measurements, the effects of gate annealing were experimentally evaluated. The results show a significant reduction in gate leakage current and noticeable improvements in DC/RF performance for the devices that underwent gate annealing. The study confirms that the annealing process can effectively enhance device performance by modifying the material properties at the gate interface.
KSP Keywords
AND gate, AlGaN/GaN HEMTs, Carrier density, Electrical analysis, Energy band gap, Frequency efficiency, Gallium nitride (gan), Gate annealing, High frequency(HF), High power applications, High-electron mobility transistor(HEMT)
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
CC BY