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Conference Paper
Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps
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- Authors
- Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Seok-Hwan Moon, Ho-Gyeong Yun, Ji-Eun Jung, Ga-Eun Lee, Kwang-Seong Choi
- Issue Date
- 2024-11
- Citation
- International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Conductive paste, Laser-assisted, Non-conductive, Solder bump