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Conference Paper Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection
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Authors
Gwang-Mun Choi, Ki-Seok Jang, Jin-Hyuk Oh, Jiho Joo, Jungho Shin, Chanmi Lee, Ho-Gyeong Yun, Seok-Hwan Moon, Ji-Eun Jung, Gaeun Lee, Kwang-Seong Choi, Yong-Sung Eom
Issue Date
2024-11
Citation
International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164
Language
English
Type
Conference Paper
KSP Keywords
Carbon epoxy, Epoxy-siloxane, Low-carbon, Solder bump, fine pitch
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