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Conference Paper
Sustainable Epoxy-Functionalized Vanillic Acid-Siloxane Nanocomposite Adhesive for Fine-Pitch Solder Bump Interconnection
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- Authors
- G.M. Choi, K.S. Jang, J.H. Oh, J. Joo, J. Shin, C. Lee, H.G. Yun, S.H. Moon, J.E. Jung, G. Lee, K.S. Choi, Y.S. Eom
- Issue Date
- 2024-09
- Citation
- European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1
- Publisher
- E-MRS
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Epoxy-functionalized, Fine pitch, Nanocomposite adhesive, Solder bump, Vanillic acid