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Conference Paper
Enhancing Reliability of 30μm-Pitch Interconnections Using Room Temperature Laser-Assisted Bonding with Compression (LABC) with Laser Non-Conductive Paste (LNCP)
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- Authors
- Gaeun Lee, Jiho Joo, Yong-Sung Eom, Gwang-Mun Choi, Ki-Seok Jang, Jungho Shin, Chanmi Lee, Jin -Hyuk Oh, Ji-Eun Jung, Seong-Cheol Kim, Seung-Yun Lee, Kwang-Seong Choi
- Issue Date
- 2024-11
- Citation
- International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-14
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Conductive paste, Laser-Assisted Bonding, Non-conductive, Room temperature