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Conference Paper
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
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- Authors
- J.H. Oh, S.Y. Lim, K.S. Jang, J. Joo, J.H. Shin, C. Lee, J.E. Jung, G. Lee, H.G. Yun, K.S. Choi, Y.S. Eom, S.H. Moon, G.M. Choi
- Issue Date
- 2024-09
- Citation
- European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1
- Publisher
- E-MRS
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Boron nitride, Heat dissipation, Non-conductive film, Solder bump, fine pitch, high thermal conductivity, nitride-based