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Conference Paper
The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package
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- Authors
- Jiwon Yoon, Youngsu Kwon, Hyunwoo Kim, Juhyeon Lee, Joungho Kim, Sungjin Kim, Heejun Jang, Kyun Ahn, Jinhan Kim, Taekyeong Hwang, Yi-Gyeong Kim, Minseok Choi
- Issue Date
- 2024-05
- Citation
- Electronic Components and Technology Conference (ECTC) 2024, pp.1687-1693
- Language
- English
- Type
- Conference Paper
- Abstract
- In this paper, we presented an AI hyperscale processing unit (HPU), integrating a pair of neural processing unit (NPU) and 8 high bandwidth memory (HBM) chiplets above a large scale advanced package, redistribution layer (RDL) interposer. We construct the advanced chiplet package platform (CPP) for AI HPU to ensure stable and reliable function. The CPP encompasses NPU-HBM channel design for high speed signaling, fast & accurate power distribution network (PDN) design and analysis, and thermal integrity analysis for efficient cooling structure.
- KSP Keywords
- Channel design, Cooling structure, Distribution network(DN), Efficient cooling, High speed signaling, Neural processing, Power distribution network, Processing unit, Redistribution layer, design and analysis, energy-efficient