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Journal Article 국내 반도체 첨단 패키징 R&D 정책방향: 산학연 전문가 조사를 중심으로

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Authors: 민수진, 박종현, 최새솔

Issue Date: 2024-06

Citation: 전자통신동향분석, v.39, no.3, pp.1-12

ISSN: 1225-6455

Publisher: 한국전자통신연구원

Language: Korean

Type: Journal Article

DOI: https://dx.doi.org/10.22648/ETRI.2024.J.390301

This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)

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