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Conference Paper
An analysis of Cu filling and aspect ratio of TGV in glass core for 0.8Tbps SiPh optical chiplet application
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- Authors
- Jyung Chan Lee, Joon Ki Lee
- Issue Date
- 2025-02
- Citation
- 한국광학회 학술 발표회 (동계) 2025, pp.1-1
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- aspect ratio