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Journal Article 3D 적층을 위한 화합물 반도체 소재 기술 동향

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Authors: 곽희민, 곽현탁, 김동영, 이형석, 배성범

Issue Date: 2025-02

Citation: 전자통신동향분석, v.40, no.1, pp.44-53

ISSN: 1225-6455

Publisher: 한국전자통신연구원

Language: Korean

Type: Journal Article

DOI: https://dx.doi.org/10.22648/ETRI.2025.J.400105

This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)

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