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Journal Article
Structural Evolution and Cu Diffusion Mechanism in Bi2Se3 Thin Films on YBa2Cu3O7 as a Function of Cracked-Se Processing Time
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- Authors
- Woo-Jung Lee, Dae-Hyung Cho, Tae-Ha Hwang, Jin Young Maeng, Kwangsik Jeong, So-Young Lim, Rina Kim, Yong-Duck Chung, Jonghyun Song
- Issue Date
- 2025-03
- Citation
- Crystal Growth & Design, v.25, no.5, pp.1439-1447
- ISSN
- 1528-7483
- Publisher
- American Chemical Society
- Language
- English
- Type
- Journal Article
- KSP Keywords
- Cu diffusion, Structural evolution, cracked-Se, diffusion mechanism, processing time, thin film(TF)