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Journal Article Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
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Authors
Jungrak Choi, Chankyu Han, Donho Lee, Hyunjin Kim, Gihun Lee, Ji-Hwan Ha, Yongrok Jeong, Junseong Ahn, Hyunkyu Park, Hyeonseok Han, Seokjoo Cho, Jimin Gu, Inkyu Park
Issue Date
2025-05
Citation
SCIENCE ADVANCES, v.11, no.20, pp.1-12
ISSN
2375-2548
Publisher
AMER ASSOC ADVANCEMENT SCIENCE
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1126/sciadv.adv0057
Abstract
The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (R2 = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.
KSP Keywords
2d films, Acoustic waves, Body Weight, Broad spectrum, Design and fabrication, Fabrication method, Fast Response, Health care, High Sensitivity, High linearity, High performance
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
CC BY