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Conference Paper Impact of Cu Buffer Layer on Interface Dynamics between Bi2Se3 and YBa2Cu3O7 Thin Films
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Authors
Woo-Jung Lee, Dae-Hyung Cho, Tae-Ha Hwang, So-Young Lim, Rina Kim, Yong-Duck Chung
Issue Date
2025-05
Citation
European Materials Research Society (E-MRS) Meeting 2025 (Spring), pp.1-1
Language
English
Type
Conference Paper
KSP Keywords
Interface dynamics, buffer layer, thin film(TF)
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