BROWSE
Detail
Conference Paper
Localized Formation of Laser Non-conductive Film (NCF) on 10 μm Diameter Bumps, Applied to 20 μm Pitch Chiplet Chip-on-Wafer (CoW) Bonding
Cited - time in 
Share 
Share
- Authors
- Jungho Shin, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-Seok Jang, Jin-Hyuk Oh, Ji-Eun Jung, Ga-Eun Lee, Seong-Cheol Kim, Yong-Sung Eom, Kwang-Seong Choi
- Issue Date
- 2025-05
- Citation
- Electronic Components and Technology Conference (ECTC) 2025, pp.1-6
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Chip-on-Wafer, Non-conductive film