ETRI Knowledge Sharing Platform : Enhancing Reliability of 30μm-Pitch Interconnections by Optimizing Material Properties of Laser NonConductive Paste (LNCP) for Room Temperature Laser-Assisted Bonding with Compression (LABC)

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Conference Paper Enhancing Reliability of 30μm-Pitch Interconnections by Optimizing Material Properties of Laser NonConductive Paste (LNCP) for Room Temperature Laser-Assisted Bonding with Compression (LABC)

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Authors: Ga-Eun Lee, Jiho Joo, Ki-Seok Jang, Young-Sung Eom, Gwang-Mun Choi, Jungho Shin, Chanmi Lee, Jin-Hyuk Oh, Jieun Jung, Seong-Cheol Kim, Seung-Yoon Lee, Kwang-Seong Choi

Issue Date: 2025-05

Citation: Electronic Components and Technology Conference, pp.1-7

Language: English

Type: Conference Paper

KSP Keywords: Laser-Assisted Bonding, Room temperature, material properties

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