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Conference Paper 2.5D/3D Stacked Optical Chiplet Enabling Tera bit/s-Scale Optical Interfaces: Advanced Packaging and Material Innovations
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Authors
Jyung Chan Lee, Joon Ki Lee
Issue Date
2025-08
Citation
International Conference on the Physics of Non-Crystalline Solids (PNCS) 2025, pp.62-62
Language
English
Type
Conference Paper
KSP Keywords
3D stacked, Advanced packaging
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