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Journal Article
Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
- Authors
- Jungrak Choi, Chankyu Han, Donho Lee, Hyunjin Kim, Gihun Lee, Ji-Hwan Ha, Yongrok Jeong, Junseong Ahn, Hyunkyu Park, Hyeonseok Han, Seokjoo Cho, Jimin Gu, Inkyu Park
- Issue Date
- 2025-05
- Citation
- Science Advances, v.11, no.20, pp.1-12
- ISSN
- 2375-2548
- Publisher
- American Association for the Advancement of Science
- Language
- English
- Type
- Journal Article
- Abstract
- The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (R2 = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
(CC BY)
