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Conference Paper
Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding
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- Authors
- Kwang-Seong Choi, Sun-Woo Choo, Jong-Jin Lee, Ki-Jun Sung, Hyun-Chel Bae, Byeong-Ok Lim, Jong-Tae Moon, Yong-Sung Eom
- Issue Date
- 2010-08
- Citation
- International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805
- Language
- English
- Type
- Conference Paper
- Abstract
- Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology (SoP) of the fine pitch flip chip bonding. With this material, the solder bump array was successfully formed with pitch of 150 μm in one direction. © 2010 IEEE.
- KSP Keywords
- Cost-effectiveness, Flip-chip(FC), Flip-chip bonding, Solder bump, fine pitch