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Journal Article
Recent Advances in Transfer and Bonding of Micro-LEDs for Micro-LED Display Fabrication
- Authors
- Jungho Shin, Jiho Joo
- Issue Date
- 2025-11
- Citation
- 전기전자재료학회논문지, v.38, no.6, pp.604-616
- ISSN
- 1226-7945
- Publisher
- 한국전기전자재료학회
- Language
- Korean
- Type
- Journal Article
- Abstract
- Micro-LEDs, which have a chip size of less than 100 × 100 ㎛2, have been potential candidates for conventional LCDs and OLEDs due to their high optical power, outstanding stability, and nanosecond response time. However, Micro-LED chips are fabricated only on limited substrates due to the high-temperature metal-organic chemical vapor deposition process and lattice-mismatch issues. Therefore, the fabrication of Micro-LED displays requires complex processes such as chip fabrication, transfer, bonding, and repair. Especially, Micro-LED transfer and bonding have been critical challenges for the Micro-LED display commercialization. Here, recent advances in the transfer and bonding of Micro-LEDs are introduced, and novel Micro-LED display fabrication methods are reviewed to provide a practical outlook for both mass production and commercialization of Micro-LED displays.
- Keyword
- Micro-LED, Display, Transfer, Bonding
- KSP Keywords
- Chemical vapor deposition process, Fabrication method, Metalorganic chemical vapor deposition, Micro light-emitting diodes(micro-LEDs), Micro-LED display, Outstanding stability, Response time(RT), chip fabrication, high optical power, high temperature, lattice mismatch
This work is distributed under the term of Creative Commons License (CCL)
(CC BY NC)
(CC BY NC)
