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Conference Paper
Fine-Pitch Flip-Chip Bonding Process with Laser Non-Conductive Paste (NCP) and Laser-Assisted Bonding (LAB) for High-Reliability
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- Authors
- Ki-Seok Jang, Yong-Sung Eom, Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Chan-Mi Lee, Ga-Eun Lee, Seong-Cheol Kim, Kwang-Seong Choi
- Issue Date
- 2025-09
- Citation
- European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5
- Language
- English
- Type
- Conference Paper
- Abstract
- The advancement of fine-pitch and 3D stacking technologies has exposed the limitations of traditional fluxbased thermo-compression bonding processes in terms of reliability and processability, emphasizing the need for advance packaging technology development. To overcome these challenges, this study develops a solvent-free Laser NCP material optimized for Laser-Assisted Bonding (LAB). In addition, it is applicable to fine-pitch assemblies without requiring an underfill process, minimizes thermal stress, and ensures high precision and reliability.
- KSP Keywords
- 3D stacking, Bonding process, Conductive paste, Flip-chip(FC), Flip-chip bonding, High Reliability, Laser-Assisted Bonding, Non-conductive, Packaging technology, fine pitch, high-precision