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Conference Paper
A Novel Photo-Patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-Chip Interconnections
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- Authors
- Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Ki-Seok Jang, Chanmi Lee, Gyeongmin Park, Hyemi Lee, Hyeryeon Hwang, Ga-Eun Lee, Seong-Cheol Kim, Jaejun Lee, Kwang-Seong Choi, Yong-Sung Eom
- Issue Date
- 2025-09
- Citation
- European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Epoxy flux, Flip-chip(FC), Flux material, fine pitch