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Conference Paper
A Novel Photo-Patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-Chip Interconnections
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- Authors
- Gwang-Mun Choi, Jiho Joo, Jungho Shin, Jin-Hyuk Oh, Ki-Seok Jang, Chanmi Lee, Gyeongmin Park, Hyemi Lee, Hyeryeon Hwang, Ga-Eun Lee, Seong-Cheol Kim, Jaejun Lee, Kwang-Seong Choi, Yong-Sung Eom
- Issue Date
- 2025-09
- Citation
- European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5
- Language
- English
- Type
- Conference Paper
- Abstract
- Advanced semiconductor packaging technology has been heading toward the optimized combination of excellent performance, high integration, good reliability, low power consumption, and low cost. As a part of this trend, new advanced package such as 3D stacking and chiplet integration has been recently developed, which leads that new materials and processing solutions which are able to pierce conventional limitations are desperately required. In this study, we demonstrated for the first time a photo-patternable epoxy flux (PEF) applicable to solder bumped flip-chip bonding. Similar to conventional photoresists used in semiconductor front-end process, it was confirmed that the PEF is capable of spin coating and photo-curing. Furthermore, after photo-curing, the unique feature was demonstrated that above a certain temperature, not only physical shape change is possible owing to dynamic covalent bond exchange, but also functional groups to remove the metal oxide can be activated. In addition, contrary to the conventional flux, the cleaning process after the soldering is not required because the cured PEF can protect the solder joint similar to underfill materials. In other words, the PEF introduces a novel material solution that simultaneously serves as both flux and underfill even after curing. This enables a process innovation in flip-chip bonding, particularly advantageous for fine-pitch interconnections. We believe that this new class of material opens a promising pathway for next-generation flip-chip packaging, beyond the capabilities of conventional materials.
- KSP Keywords
- 3D stacking, Cleaning process, Epoxy flux, Flip-chip(FC), Flip-chip bonding, Flip-chip packaging, Flux material, Front-End, Functional groups, Low Power consumption, Low-cost