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Conference Paper
Selective Formation of Bonding Materials on Micro-bumps via Laser Non-conductive Film Dipping for 20 μm Pitch Interconnections
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- Authors
- Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-seok Jang, Jin-hyuk Oh, Ga-Eun Lee, Seong-Cheol Kim, Yong-Sung Eom, Kwang-Seong Choi, Jungho Shin
- Issue Date
- 2025-11
- Citation
- International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-18
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Micro-bumps, Non-conductive film, Selective formation