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Conference Paper Reliability Analysis of Laser-Assisted Bonding with Compression (LABC) Using Non-Conductive Film (NCF) Containing Spherical h-BN Filler
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Authors
Seong-Cheol Kim, Yong-Sung Eom, Gwang-Mun Choi, Jungho Shin, Chanmi Lee, Ki-Seok Jang, Jin-Hyuk Oh, Gaeun Lee, Miri Yoon, Seung-Yun Lee, Keunhoi Kim, Kwang-Seong Choi, Jiho Joo
Issue Date
2025-11
Citation
International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1
Language
English
Type
Conference Paper
KSP Keywords
Laser-Assisted Bonding, Non-conductive film, hexagonal boron nitride(hBN), reliability analysis
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