ETRI-Knowledge Sharing Plaform

KOREAN

BROWSE

Titles

Home Titles Articles
논문 검색
Type SCI
Year ~ Keyword

Detail

List
Conference Paper Reliability Analysis of Fine-Pitch Interconnections Using Epoxy-Based Laser Bonding Materials with Different Glass Transition Temperatures
Cited - time in scopus Share share facebook twitter linkedin kakaostory
Authors
Ga-Eun Lee, Yong-Sung Eom, Gwang-Mun Choi, Jungho Shin, Ki-Seok Jang, Chanmi Lee, Jin-Hyuk Oh, Seong-Cheol Kim, Mi-Ri Yoon, Seung-Yun Lee, Kwang-Seong Choi, Jiho Joo
Issue Date
2025-11
Citation
International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1
Language
English
Type
Conference Paper
KSP Keywords
Epoxy-based, Laser bonding, fine pitch, glass transition temperature, reliability analysis
Copyright Policy Privacy Policy

218 Gajeong-ro, Yuseong-gu, Daejeon, 34129, KOREA, Contact: sh.kim@etri.re.kr

2016 Electronics and Telecommunications Research Institute. All rights reserved.

Please refrain from automatic collection of e-mail addresses posted on this homepage.

제1유형