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Conference Paper
Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections
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- Authors
- Kwang-Seong Choi, Jiho Joo, Gwang-Mun Choi, Jungho Shin, Chanmi Lee, Ki-Seok Jang, Jin-Hyuk Oh, Ho-Gyeong Yun, Seok Hwan Moon, Gaeun Lee, Seong Cheol Kim, Yong-Sung Eom, Youn Sung Ko
- Issue Date
- 2025-05
- Citation
- Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957
- Language
- English
- Type
- Conference Paper
- KSP Keywords
- Advanced 3D, Environmentally friendly, Laser-Assisted Bonding, Solder paste