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Conference Paper Heterogeneous Integration through 2.5D Silicon Interposers for Next-Generation AI and HPC Applications
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Authors
Deok-kee Kim, Honggyun Kim, Youngwoo Kim, Yi-Gyeong Kim, Min-Hyung Cho, Jinho Han, Tae Hyun Kim, Jae-Sub Oh, Yong Kuk Kim, Seungbae Park
Issue Date
2025-11
Citation
International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1
Language
English
Type
Conference Paper
KSP Keywords
HPC Application, Next-generation, heterogeneous integration, silicon interposer
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