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Journal Article Mechanochemically Activatable Liquid Metal Powders for Sustainable, Reconfigurable, and Versatile Electronics
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Authors
Osman Gul, Junseong Ahn, Hye Jin Kim, Xinge Yu, Inkyu Park
Issue Date
2026-03
Citation
Advanced Functional Materials, v.36, no.22, pp.1-12
ISSN
1616-301X
Publisher
John Wiley & Sons
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1002/adfm.202527396
Abstract
While liquid metals possess exceptional electrical conductivity, their integration into stretchable and recyclable electronics remains constrained. High surface tension causes poor adhesion and uncontrolled spreading, and current processing methods often lack scalability or recyclability, limiting broader adoption in soft robotics, wearable healthcare, and sustainable systems. Here, a class of mechanochemically activatable liquid metal powders (MALMPs) is introduced that decouple conductivity from fluidity, enabling ambient stable, recyclable, and user-defined soft circuits. Sonication dispersion of eutectic gallium–indium in carbonyl-rich solvents yields core–shell particles with oxide-stabilized surfaces. These powders remain electrically inert under ambient conditions but can be locally activated by mechanical pressure, which ruptures the shell to restore conductivity. This mechanism allows dry-state patterning on a wide range of substrates, including flexible, stretchable, and biological surfaces, followed by localized fluidization upon mechanical activation to induce conductivity. MALMPs maintain stable conductivity under >10 000 stretching cycles and 700% strain and can be fully recycled via mild sodium hydroxide (NaOH) treatment. Demonstrations across transient and reconfigurable circuits, human–machine interfaces, and skin-conformal systems highlight the versatility and scalability of the platform for next-generation electronics.
Keyword
liquid metals, reconfigurable electronics, recyclable electronics, stretchable electronics, universal substrate
KSP Keywords
Biological surfaces, Electrical Conductivity, Mechanical pressure, Metal powders, Next-generation, Processing Method, STRETCHABLE ELECTRONICS, Sodium Hydroxide, Soft Circuits, Surface tension(ST), Sustainable systems