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Conference Paper
A warpage of a glass substrate caused by a coefficient of thermal expansion (CTE) mismatch in optical chiplet
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- Authors
- Jyung Chan Lee, Ji Dea Kim, Joon Ki Lee
- Issue Date
- 2026-02
- Citation
- 한국광학회 학술 발표회 (동계) 2026, pp.1-1
- Publisher
- 한국광학회
- Language
- English
- Type
- Conference Paper
- Abstract
- We present an analysis of a warpage characteristics of a glass substrate caused by a coefficient of thermal expansion (CTE) mismatch in optical chiplet.
- KSP Keywords
- Coefficient of thermal expansion, Glass substrate