European Materials Research Society (E-MRS) Meeting 2026 (Spring), pp.1-1
Publisher
European Materials Research Society (E-MRS)
Language
English
Type
Conference Paper
Abstract
Hybrid heterostructures combining high-temperature superconductors and topological
insulators are promising candidates for superconducting and quantum device applications.
However, their practical implementation is severely limited by interfacial reactions and
elemental diffusion originating from cuprate superconductors. In this study, we investigate
YBa2Cu3O7 (YBCO)/Bi2Se3 heterostructures incorporating an ultrathin Al2O3 buffer layer and
systematically examine the influence of buffer layer thickness on interfacial stability and
device characteristics. To elucidate the thickness-dependent role of the Al2O3 buffer layer,
interfaces in YBCO/Al2O3/Bi2Se3 heterostructures were systematically characterized by
Raman spectroscopy, high-resolution transmission electron microscopy, and depth-resolved X-
ray photoelectron spectroscopy. We find that the insertion of Al2O3 effectively suppresses Cu
and Ba diffusion from YBCO, while the degree of diffusion suppression and mixed interfacial
layer formation strongly depends on the buffer layer thickness. An optimized Al2O3 thickness
significantly improves the structural integrity of the layered Bi2Se3 film, whereas excessively
thin or thick buffers result in incomplete diffusion blocking or degraded interface quality.
Electrical transport measurements demonstrate that heterostructures with an optimized Al2O3
buffer layer thickness exhibit enhanced superconducting properties and more stable device
behavior compared to unbuffered or non-optimized structures. These results highlight the
critical role of buffer-layer thickness in interface engineering superconductor and topological
insulator heterostructures, and provide practical design guidelines for YBCO-based
superconducting and quantum devices.
KSP Keywords
Buffer layer thickness, Cuprate superconductors, Device characteristics, Diffusion blocking, Electrical transport measurements, Electron Microscopy(TEM and SEM), Hybrid heterostructures, Interfacial engineering, Interfacial stability, Layer formation, Practical design
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