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Conference Paper
Arcing Mitigation in Microwave Heating of Fine-Pitch Cu RDLs Using a Field-Homogenizing Plate
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- Authors
- Gwang-Mun Choi, Jungho Shin, Jiho Joo, Ki-Seok Jang, Jin-Hyuk Oh, Chanmi Lee, Seok-Hwan Moon, Kwang-Seong Choi, Yong-Sung Eom
- Issue Date
- 2026-06
- Citation
- Annual Microwave Power Symposium 2026, pp.1-3
- Publisher
- International Microwave Power Institute
- Language
- English
- Type
- Conference Paper
- Keyword
- Microwave heating, Variable-frequency microwave, Heterogeneous integration packaging, Copper redistribution layer, Field-homogenizing plate
- KSP Keywords
- Fine pitch, Heterogeneous integration, Microwave heating, Variable frequency, redistribution layer(RDL)