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Journal Article Bio-derived isosorbide–siloxane molecular hybrid epoxy resins for fast-curing and degradable high-performance adhesives
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Authors
Gwang-Mun Choi, Jin-Hyuk Oh, Ki-Seok Jang, Yong-Sung Eom, Kwang-Seong Choi
Issue Date
2026-08
Citation
European Polymer Journal, v.255, pp.1-10
ISSN
0014-3057
Publisher
Elsevier
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1016/j.eurpolymj.2026.114877
Abstract
Cycloaliphatic epoxy resins are widely used in electronic and structural adhesive applications because of their excellent thermal stability and mechanical performance. However, conventional epoxy systems often require inorganic fillers to achieve sufficient thermomechanical performance and generally lack inherent degradability, thus raising concerns regarding end-of-life management. Here, we report an epoxy-functionalized isosorbide–siloxane molecular hybrid resin (EIS) synthesized via base-catalysed condensation of bio-derived isosorbide and an epoxy-functional alkoxysilane. The resulting oligomer preserves cycloaliphatic epoxide groups for subsequent cationic curing while incorporating hydrolytically labile silyl ether linkages within the backbone. Compared with the reference cycloaliphatic epoxy formulation, the EIS-based resin exhibits accelerated cationic curing behaviour and forms a cured hybrid network with improved thermomechanical performance and die-attach adhesion. In addition, the incorporation of alkali-labile Si–O–C silyl ether linkages enables alkaline-triggered degradation, providing a chemically addressable pathway for end-of-life disassembly. These results demonstrate that molecular-level integration of rigid bio-derived segments with an inorganic siloxane framework provides filler-free reinforcement while introducing a chemically addressable degradation pathway. This molecular hybrid design is a promising strategy for developing fast-curing, high-performance, degradable epoxy adhesives for sustainable electronic and structural applications.
Keyword
Bio-based epoxy, High-performance adhesive, Molecular hybrid materials, Siloxane network, Sustainable thermoset
KSP Keywords
Cationic curing, Cycloaliphatic epoxide, Cycloaliphatic epoxy resins, Degradation pathway, Die-Attach, End-of-life management, Epoxy-functionalized, High performance, Hybrid epoxy, Hybrid resin, Inorganic fillers
This work is distributed under the term of Creative Commons License (CCL)
(CC BY)
CC BY