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Conference Paper
A Study on 2.5D Stacked Optical Chiplets on Glass Substrate for Terabit-Scale Interconnects
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- Authors
- Jyung Chan Lee, Joon Ki Lee
- Issue Date
- 2026-06
- Citation
- Opto-Electronics and Communications Conference (OECC) 2026, pp.83-84
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- We demonstrate 2.5D optical chiplets on glass, overcoming 'Se-Wa-Re' challenges. Results confirm 80 μm warpage on glass wafer and >50 GHz bandwidth, proving 2.5D/3D stacking and optical I/O essential for AI 'Scale-in' and 'Scale-out' architectures.
- KSP Keywords
- 3D stacking, Glass substrate, Glass wafer, Scale-out