본 연구는 미국 전쟁부가 공개한 마이크로일렉트로닉스 로드맵과 2027 회계연도 예산 자료를 분석하고, 한국의 산업·제도 여건과 비교하여 국방반도체 연구개발 투자전략 시사점을 제시한다. 한국은 메모리, 첨단 제조 및 패키징 역량을 보유하지만, 시스템반도체 설계, 국방 특화 설계자산, 소량·다품종 생산, 신뢰성시험·인증 및 장기 구매 기반은 취약하다. 국회는 무기체계 적용 국방반도체의 98.9%가 수입에 의존한다고 지적한다. 미국 예산에서 마이크로일렉트로닉스 직접 라인은 5억 7,300만 달러이나 자율·무인체계, 방위산업기반, 미사일방어 등 광의의 수요견인 포트폴리오는 훨씬 크다. 다만 두 수치는 각각 반도체 직접예산과 체계사업 수요를 나타내므로 동일 기준으로 비교할 수 없다. 본 연구는 한·미 구조 차이를 반영하여 기반공백 보완과 선택적 특화를 결합한 이중트랙 전략을 제시한다. 가중평가 결과 국방형 실증·시험·인증·우선구매 기반, 신뢰 설계·보안 검증, 디지털 로직·AI·FPGA/SoC, 센서·아날로그·전력관리, 첨단패키징·칩렛, RF·전력, 내방사선·우주반도체 순으로 우선순위가 도출되었다.
Keyword
국방반도체, 마이크로일렉트로닉스, 첨단패키징, 국방형 Fab, 연구개발
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