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Conference Paper
Glass Substrate-Incorporated Optical Packaging for AI Infrastructure: Business Trends and Future Strategies
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- Authors
- Jyung Chan Lee, Joon Ki Lee
- Issue Date
- 2026-07
- Citation
- Optics and Photonics Congress (OPC) 2026, pp.1-2
- Publisher
- 한국광학회
- Language
- English
- Type
- Conference Paper
- Abstract
- This paper examines glass substrate-incorporated optical packaging as a pivotal solution for the burgeoning AI semiconductor era. We propose high-density 2.5D/3D integration leveraging Through-Glass Via (TGV) technology to support next-generation 0.8/1.6 Tb/s high-speed interfaces. The study further details the assembly of IC-TROSA and offers strategic solutions for critical challenges such as precision optical alignment and thermal management to bolster future AI infrastructure.
- KSP Keywords
- 3D Integration, Glass substrate, High-Density, Next-generation, Optical packaging, Through-glass via, high-speed interfaces, optical alignment, thermal management