Cu(In,Ga)Se2 박막 태양전지에서 Zn(O,S) 버퍼층을 스퍼터링으로 증착할 때 발생하는 플라즈마 손상은 소자 효율 저하의 주요 원인이다. 본 연구에서는 반응성 스퍼터링 시 수소 및 산소 혼합가스 도입이 하부 반도체 박막에 미치는 영향을 n형 및 p형 GaAs 박막을 이용하여 정량적으로 비교·분석하였다. 증착된 Zn(O,S) 박막 제거 후 Hall 측정을 수행한 결과, n형 GaAs 박막의 면저항은 수소 첨가 여부와 관계없이 캐리어 농도 감소에 의해 증가하였고, 이동도는 비교적 일정하게 유지되었다. 반면, p형 GaAs 박막은 수소 혼합가스만 도입 시 면저항의 급격한 증가와 이동도의 심각한 감소를 보였으나, 산소 혼합가스가 동시에 공급되는 경우 1%의 산소 농도부터 면저항 감소가 나타나 열화 완화가 시작되었으며, 2%와 3.3%의 산소 농도에서 보다 뚜렷한 완화 효과가 확인되었다. 이러한 결과는 하부 반도체의 도핑 유형에 따라 수소에 대한 반응이 명확히 다름을 보여주며, 일정량의 산소 공급이 동반될 때 수소가 p형 반도체의 스퍼터링 손상을 효과적으로 완화할 수 있음을 시사한다.
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