상세정보
학술대회
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
- 발행일
- 201008
- 출처
- International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189
- 협약과제
- 10ZB1100, 융.복합부품 핵심기술 연구, 남은수
- 초록
- The electroplating and screen printing are widely used in the micro-electric industry but they have disadvantages of a complicated series of bumping process, equipments and materials. Furthermore, they are not suitable for the fine pitch bumping technology. To overcome these weak points, a maskless bumping technology using SBM has been developed. Solder Bump Masker (SBM) technology does not need any special equipment and mask tools. It is composed of solder powder and a resin. The solder is Sn58Bi and the resin is designed to have low viscosity for rheological characteristics of the solder droplets. In this paper, we optimized the bumping condition with controlling the process time. After bumping, the coining process, which the various loads were applied, has been investigated to get the bump with the extremely uniform heights. Finally, low-volume bumps with the excellent uniformity were successfully achieved. © 2010 IEEE.
- KSP 제안 키워드
- 3D packages, Coining process, Fine pitch, Low viscosity, Rheological characteristics, Solder bump, Special equipment, excellent uniformity, low-volume, process time, screen printing