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Journal Article Feasibility evaluation and performance enhancement of surface-wave-based communication in metallic structures
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Authors
Won-Young Song, Seok-Bong Hyun, Seunghyun Jang
Citation
ETRI Journal, Early Access
ISSN
1225-6463
Publisher
한국전자통신연구원
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.4218/etrij.2025-0510
Abstract
This study verifies the feasibility of surface-wave communication as a solution to the severe attenuation and multipath fading encountered by free-space wireless systems in metallic environments. Surface-wave characteristics on dielectric-coated metal surfaces are analyzed in terms of field distribution and attenuation with respect to dielectric thickness and frequency. Experiments conducted in a structure emulating a watertight door show that placing a dielectric layer on the metal surface increases the received signal strength by about 5 dB and improves throughput by more than fourfold compared with the case without the dielectric layer. Additional experiments comparing surface-wave and free-space communication in the same ship-like structure demonstrate that surface-wave communication achieves approximately a 7 dB increase in received signal strength and more than a 15-fold improvement in throughput relative to free-space propagation. These results confirm that surface-wave techniques can significantly enhance wireless coverage and reliability inside dense metallic structures and provide practical insights for future industrial wireless communication system design.
Keyword
channel model, communication performance, dielectric thickness, experimental results, surface wave
KSP Keywords
Communication performance, Dielectric thickness, Free-space communication, Industrial wireless communication, Received Signal Strength(RSS), Ship-like structure, Surface wave, Wave characteristics, channel model, dielectric layer, feasibility evaluation
This work is distributed under the term of Korea Open Government License (KOGL)
(Type 4: : Type 1 + Commercial Use Prohibition+Change Prohibition)
Type 4: