상세정보
학술대회
A Surface-Micromachined MEMS Acoustic Sensor with Back-Plate Anchors of 100 μm Depth
- 발행일
- 201110
- 출처
- SENSORS 2011, pp.1-4
- 협약과제
- 11MB2100, 스마트and그린 빌딩용 자가충전 지능형 센서노드 플랫폼 핵심기술 개발, 김종대
- 초록
- A surface-micromachined capacitive-type microelectro-mechanical system (MEMS) acoustic sensor with back-plate anchors of 100 μm depth is presented. The sensor is implemented by a simple front-side fabrication process of a Si substrate with a compatibility with a full CMOS process. For only the front-side process, the back-plate anchors are placed under a back-plate and inserted very deeply into the substrate by Deep Reactive-Ion Etching (DRIE), and their upper part is covered with a thick back-plate of 2.9 μm. Also, a diaphragm is composed entirely of standard CMOS process layers for a monolithic integration. It has a diameter of 500 μm and a back chamber depth of around 80 μm. After a sacrificial layer of 2.2 μm is released, the back chamber is realized by XeF2 etcher as well as the back-plate anchors, simultaneously. Thus, it shows a measured zero-bias capacitance (C mea) of 1.1 pF at 10 kHz and a pull-in voltage (V pull) of 35.6 V, and an open-circuit sensitivity (S 0) of 1.62 mV/Pa on a DC bias of 6 V. © 2011 IEEE.
- KSP 제안 키워드
- Acoustic Sensor, Back-plate, Capacitive-type, Front-side, Micro-electro-mechanical system(MEMS), Monolithic Integration, Open circuit, Plate anchors, Process layer, Reactive ion etching(RIE), Sacrificial layer